High-Temperature Resistant Adhesive Transfer Tape (for Lead-Free Solder Reflow)
Low adhesive application of the adhesive material, excellent processability! Adhesive transfer tape that withstands high temperatures.
This product is an adhesive transfer tape that withstands high temperatures (260°C) during lead-free solder reflow processes. After passing through lead-free solder reflow, the degradation of the release paper is minimal, and the reduction in adhesive strength is significantly smaller compared to conventional tapes. Additionally, it has excellent heat retention properties, resulting in less shifting at high temperatures, and due to the inclusion of a substrate, there is less adhesive bleed, making it easy to process. It is suitable for adhesive applications in FPC (Flexible Printed Circuit). 【Features】 - Minimal degradation of the release paper after passing through lead-free solder reflow, allowing for easy release. - The reduction in adhesive strength after lead-free solder reflow is smaller than that of conventional tapes. - Excellent heat retention properties, resulting in less shifting at high temperatures. - Due to the inclusion of a substrate, there is less adhesive bleed, making it easy to process. - Generates minimal outgassing, reducing its impact on electronic components. *For more details, please refer to the PDF document or feel free to contact us.
- Company：イザワ
- Price：Other
